ICMIC invites the submissions of original, unpublished research works that are currently not under review. Authors can submit either 4-page (max) regular papers or 1 or 2-page (max) work-in-process (WIP) papers. Extended versions of selected papers will be invited for journal publications in Electronics (MDPI). We have decided to allow the submission of WIP to share the latest results with the research community. Note that WIP papers emphasize the novelty of the work, not completeness. All submissions should be in PDF format, formatted with single-spaced, two-column pages using at least 10 pt (or higher) size fonts on A4 or letter pages, following the standard IEEE conference templates.
Paper Submission Deadline: June 16, 2023
Papers should be submitted through this link:
Standard IEEE conference template is available at:
All camera-ready submissions must be made electronically in PDF format and uploaded at the ICMIC submission website. The final camera-ready papers should account for all the critical reviewers’ concerns and comments. Authors can submit either 4-page (max) regular papers or 2-page (max) work-in-process (WIP) papers. Papers exceeding the page limit will not be accepted. All camera-ready manuscript submissions MUST be formatted with the standard IEEE conference templates. Furthermore, for the papers to be published in the ICMIC 2023 Conference Proceedings, at least one of the authors of accepted papers is required to register for the conference at the FULL rate and must present the paper at the conference. Once you have completed your final manuscript and registration, you can upload the PDF file at the ICMIC submission website.
Camera-ready Submission Deadline: July 23, 2023